Determination of Microstructure and Strength of Diffusion Bonded 2014 AA Alloys by Using Copper Interlayer

This paper reveals the characterization of diffusion connection of aluminum alloy AA 2014 with and without applying copper powder. Joining was achieved in va-cuum up to (1 × 10-5 mbar) by means of vacuum system. The main awkwardness when joining AA2014 is the development of brittle intermetallic and oxide films in the bond region. However, diffusion bonding can easily be used to combine these alloys. Aluminum alloy AA2014 samples were done as cylinder form and interlayer thickness was equal 100 m, under joining conditions of (325oC - 475oC) and 4 MPa and period of (1 hour). It was discovered that the maximum strength was 188.36 MPa. Light microscopy was used to examine the bonding joint, SEM with (EDS) was used to determine the microstructure and depth of diffusion, and microhardness was also used at the connection zone. The main interme- tallic compound phase formula, according to XRD results, was Al2C. 19.1 m was the maximum depth of diffusion attained.